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PayFlow raises $12M Seed to expand marketplace payments across Southeast Asia

Round Seed
Amount $12M
Date 15 May 2026

PayFlow said the round will fund engineering hires in Singapore and Jakarta, plus compliance work for cross-border merchant onboarding.

The company positions itself as infrastructure for platforms that need escrow, split payouts, and localized payment methods beyond a single PSP integration.

Founders cited rising marketplace GMV in Indonesia and Vietnam as the primary growth driver for 2026.

Startup profile

View PayFlow profile

Embedded payments infrastructure for Southeast Asian marketplaces and platforms.

Fintech · Seed · Singapore

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