Renxin Technology

Renxin Technology (R-Semi) develops high-performance automotive SerDes (Serializer/Deserializer) chips that enable high-speed video and image signal transmission between sensors and domain controllers, and between domain controllers and display screens in intelligent connected vehicles. The company's single-channel 16Gbps automotive SerDes chip has successfully entered mass production, manufactured using a 22nm process node, supporting 15-meter long-distance transmission with full backward rate compatibility. This chip addresses the massive demand created by automotive intelligence and connectivity trends, with the global high-speed data transmission chip market projected to reach 1.5 billion units and 30 billion RMB market size by 2025, while the Chinese market alone is expected to exceed 400 million units worth 10 billion RMB. Renxin Technology focuses on automotive electronic chip R&D, sales, software services, and module solutions, with its SerDes chips serving as critical infrastructure for transmitting high-speed video image signals from cameras and sensors to autonomous driving domain controllers and from controllers to in-vehicle display screens. The company has partnered with GAC Group to jointly release the G-T02 chip, establishing a new paradigm for autonomous driving with domestically controlled technology. Founded in 2022 and headquartered in Nanjing, China, Renxin Technology has raised approximately $27.7 million at the Series A stage from investors including SAIC Capital, Shang Qi Capital, Zhejiang Dahua Investment, Tianhong Fund, and Hangzhou Jintou Fund.