Hyperlight

Hyperlight develops transmitter photonic integrated circuits (PICs), chiplets, and packaged modulators for optical networking, built on its proprietary TFLN (thin-film lithium niobate) Chiplet platform. The company manufactures known-good-dies suitable for PAM/IMDD and coherent applications, delivering ultra-high bandwidth of 448 Gbps per lane and beyond with low energy consumption using just one laser to power up to 8 channels with direct CMOS drive. Its product lineup includes IMDD Tx PICs for pluggable transceivers, DPIQ Tx PICs for DCI and long-haul communications covering 130 Gbaud and 260 Gbaud, and packaged modulators with up to 145 GHz bandwidth. The TFLN platform enables applications across AI and datacom for hyperscale data centers, data center interconnect, telecom long-haul connections, test and measurement, quantum systems, and emerging applications like radio-over-fiber and optical switching. HyperLight partners with UMC, Wavetek, Jabil, and TFC for high-volume foundry production and data-center scale deployment. Founded in 2018 and headquartered in Cambridge, Massachusetts, HyperLight has raised $117 million in Series C funding from investors including Summit Partners, Xora Innovation, Foothill Ventures, MediaTek, Jabil, Foxconn Electronics, EDBI, Qatar Investment Authority, and Engine Ventures.