Raysees

Raysees develops advanced VCSEL (Vertical-Cavity Surface-Emitting Laser) chips, optical modules, and sensing solutions for next-generation 3D sensing and optical interconnect applications across robotics, automotive, consumer electronics, medical and beauty, advanced manufacturing, and optical interconnect markets. The company's product portfolio includes VSense Chip-Consumer, a VCSEL die for consumer electronics; VSense Chip-Automotive, a multi-junction high-power VCSEL with ultra-narrow beam divergence for automotive-grade applications; VLink Chip for optical interconnect; VIPE Solution and DigiHeat Solutions for specialized applications; VSense Engine, offering full-range VCSEL optical modules including point, line, flood, array, and speckle configurations; and VCSEL Driver Board for driving VCSEL arrays. Raysees provides product customization services engineered for specific application requirements, leveraging core technologies in VCSEL design, optical packaging, and volume manufacturing. The company serves over 100 customers worldwide with applications spanning face recognition, security monitoring, iris recognition, smart home, assisted driving, LiDAR, UAV vision, smart logistics, and 3D scanning, positioning itself as a provider of advanced photonic technologies for sensing and connectivity. Founded in 2017 and headquartered in Shenzhen, China, Raysees has raised approximately $30.1 million at the Series C stage from investors including Joy Capital, Matrix, Meridian Capital, Huagai Capital, ECC Capital, Shenzhen Capital Group, Shanghai Ivy Capital, Photon Strong Chain Fund, Hefei Industrial Investment Guozheng Equity Investment, Xi'an Finance Investment Management, Hony Capital, Opensourceinnovation, Abcfund, and Shenzhen investors.